와이어 본더K&S 8020
K&S 8020
와이어 본더
K&S 8020
K&S 8020
제조 연도
2004
상태
중고
위치
Veenendaal 

가격 및 위치
- 위치:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland

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제안 세부 정보
- 광고 ID:
- A22123863
- 업데이트:
- 마지막 업데이트: 15.06.2026
설명
Known K&S 8020 Specifications
Specification Value
Bonding type Automatic thermosonic ball bonder
Wire material Gold wire (Au)
Bond head Voice-coil direct-drive bond head
Ultrasonic transducer 120 kHz unibody transducer with adaptive USG
Vision system 20/20 vision system
Camera Sony XC-75 CCD
Bond pitch capability Sub-70 µm pitch kit available
Bond area 2.0 × 2.3 in (≈ 50.8 × 58.4 mm)
Optics Universal optics with increased depth of field
Illumination LED
Workholder 250-series heated manual workholder
Power 208 V, 50/60 Hz
Control Software-controlled automatic bonding programs
Typical Process Capability
The 8020 was developed to provide:
Fine-pitch bonding
Long, low wire loops
Improved process control
High throughput for leadframe and laminate packages
Automated vision alignment and pattern recognition
These capabilities were key selling points of the 8000 family.
Applications
Plastic IC packages
SOIC, QFP, TSOP
Memory devices
ASICs
Hybrid microelectronics
Chip-on-board assemblies
Physical Characteristics
Unfortunately, a complete factory datasheet with dimensions, weight, XY-table resolution, bond-force range, and supported wire diameters is not readily available in public archives. Most of the available information comes from listings of used equipment and K&S annual reports.
If you need details such as:
Bond force range (grams)
Iasdpfx Afozdgm Djkou
Wire diameter range (e.g., 0.7–2.0 mil)
XY positioning resolution
Air requirements
Maintenance manual
Error codes or calibration procedures
이 광고는 자동으로 번역되었습니다. 번역 오류가 있을 수 있습니다.
Specification Value
Bonding type Automatic thermosonic ball bonder
Wire material Gold wire (Au)
Bond head Voice-coil direct-drive bond head
Ultrasonic transducer 120 kHz unibody transducer with adaptive USG
Vision system 20/20 vision system
Camera Sony XC-75 CCD
Bond pitch capability Sub-70 µm pitch kit available
Bond area 2.0 × 2.3 in (≈ 50.8 × 58.4 mm)
Optics Universal optics with increased depth of field
Illumination LED
Workholder 250-series heated manual workholder
Power 208 V, 50/60 Hz
Control Software-controlled automatic bonding programs
Typical Process Capability
The 8020 was developed to provide:
Fine-pitch bonding
Long, low wire loops
Improved process control
High throughput for leadframe and laminate packages
Automated vision alignment and pattern recognition
These capabilities were key selling points of the 8000 family.
Applications
Plastic IC packages
SOIC, QFP, TSOP
Memory devices
ASICs
Hybrid microelectronics
Chip-on-board assemblies
Physical Characteristics
Unfortunately, a complete factory datasheet with dimensions, weight, XY-table resolution, bond-force range, and supported wire diameters is not readily available in public archives. Most of the available information comes from listings of used equipment and K&S annual reports.
If you need details such as:
Bond force range (grams)
Iasdpfx Afozdgm Djkou
Wire diameter range (e.g., 0.7–2.0 mil)
XY positioning resolution
Air requirements
Maintenance manual
Error codes or calibration procedures
이 광고는 자동으로 번역되었습니다. 번역 오류가 있을 수 있습니다.
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최종 온라인: 지난주
등록일: 2013
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