인쇄 회로 기판용 컨벡션 리플로 납땜 시스템

REHM Refloe SMS-N2-V4 - 3000

temperature: 200-210 °C
throughput speed: 1000 mm/min
max. workpiece length: 200 mm
total power requirement: 50 kw
weight of the machine ca.: ca. 2,0 t
- Soldering device for circuit boards (e.g. Type: SMD &/or Composite design) and drying SMD adhesive.
- Soldering unit works with functions -->intake - flow - soldering - cooling
- With software functions.
- Can be integrated in a production line.

Further technical details:
- Inert gas with Nitrogen 30 m³/h; 6 - 10 bar over pressure
- Water requirement: 20 Liter/min; 2 - 5 bar over pressure
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- Exhaust quantity: 1000m³/h
- electr. Operation capacity: 12 kW
- room required: L: 6500 + loading station 2000 x W: 1400 x H: 2100mm

Supplementary equipment incl.:
- Automatic stacker LSB 03 with reloading device and discharge conveyor for intake of e.g. circuit boards
- Plant is applicable as spare part deliverer or for refurbishment or rebuild.
- Documentation available
- Machine is CE98 certified

On sale as is.